Simulate Menu


Run simulation

The "Run Simulation" icon or the command Simulate -> Start Simulation both give access to the automatic extraction and analog simulation of the layout.

Using Models

Select the model you wish to use to perform simulations. By default, the MOS model is BSIM4. Add a text on the layout starting by "LEVEL1" if you wish to use permanently the MOS level1, "LEVEL3" if you wish to use permanently the MOS level31, "BSIM4" if you wish to use permanently BSIM4.

Note: previous versions of Microwind used LEVEL3 as a default model. This was changed for the shake of accuracy.

Simulation Parameters

The default extraction includes the removal of redundant boxes (Purge) and the removal of overlaps (Merge). The fast extraction does not handle Purge nor Merge operations.

The MOS level can be chosen between level 1,3 and BSIM4. See the user's manual for more details about those models. Other options concern the computation of lateral capacitance and vertical crosstalk capacitance. The temperature may be changed in this screen.

Simulation on Layout

The simulation is performed directly on the layout with a palette of colors. The most interesting layout files to be simulated in this mode are analog blocks such as the DAC.

With Crosstalk

Crosstalk is a parasitic effect that affects long lines routed close from each other. The proximity of the interconnects creates a coupling effect that provokes crosstalk between the affector and victims. By default, the analog simulator do not consider the crosstalk capacitance.

There are three types of capacitance for interconnects: capacitance to substrate body, inter-layer capacitance and lateral crosstalk capacitance. The inter-layer capacitance refers vertical coupling between layers, while lateral crosstalk capacitance refer to adjacent interconnect coupling. The crosstalk capacitance value per unit length is given in the design rule file for a predefined interconnect width (w=4l ) and spacing (d=4l ). In Microwind, the computed crosstalk capacitance is not dependant on the interconnect width w. The computed crosstalk capacitance value is proportional to 1/d where d is the distance between interconnects.

Example: The demonstration of crosstalk can be made with the circuit CrosstalkBig.MSK. The schematic diagram of the circuit corresponds to two strong inverters, and strongly coupled interconnects. We used one interconnect "victim" fixed to Vss, surrounded by two aggressors which are switching, to exhibit the crosstalk effect.

Simulation parameters

The simulation icons add properties to the nodes. Properties are applied to the electric nodes of the circuit in order to serve as simulation guides. You must specify which node is assigned to which voltage before starting the analog simulation.

VDD & VSS. The node is pushed to the power supply voltage with icon Vdd, and pulled to the ground 0V with icon Vss.

CLOCK. When a node becomes a clock, the parameters of the latter are divided as follows : rise time, level one, fall time, and level zero. All values are expressed in nan-second (ns). If you ask for a second clock, the period will be multiplied by two.

PULSE. The pulse switches from "Level 0" (0 by default) to "Level 1" (VDD by default" depending on the user-defined time table.

SINUS. The sinusoidal waveform parameters are the amplitude, the offset, frequency and phase.

VISIBLE NODE. Click on the "eye" and click on the existing text in the layout to make the chronograms of the node appear. Initially, all nodes are invisible, but the clocks and impulse nodes are subsequently made visible.

UV Exposure

This command simulates the discharge of floating gates due to a very long exposure to ultra violet light (in practice around 20mn). As a result, all charges stored in floating polysilicon gates are discharged.

MOS Characteristics

Click on the "Mos characteristics" icon situated in the main menu. The Id/Vd curve of the default MOS (W=20µm, L=L minimum) appears.

Process Section in 2D

Click on the "Process View" icon or "Simulate-> Process Section in 2D" to access process simulation. A mouse-operated line is given and embodies the cross section. The screen below appears. The arrows can be used to move the cross-section to the right or to the left in the X axis, and forward and backward in the Y axis. Zooms in and out are available. Remove the layer names by removing the tick in front of "Layer infos".

Process Steps in 3D

Click the "3D icon" or "Simulation -> Process Steps in 3D" to see the 3-dimentionnal aspect of your circuit. Click "Next step" to watch how the layout currently edited on the screen will be fabricated using the selected technology. Use the arrow to shift the displayed portion. Zooms in and out are available.

In demo mode, the steps of the CMOS process are illustrated in sequence.

 

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